What's the benefits of modular design lighting

Lighting is a fundamental human need and a reflection of economic activity. Recent global economic growth, ongoing urbanization, and the expansion of power grids in non-urban areas have driven the construction of buildings and manufacturing facilities, leading to a rapid increase in lighting demand and energy consumption.  
LEDs, as a new type of light source, are increasingly integrated into daily life, driven by the growing need for efficient lighting. Compared to traditional light sources like fluorescent lamps and incandescent bulbs, LEDs offer 5 to 20 times higher luminous efficiency due to their near-theoretical conversion efficiency. Even at current mass production levels, their efficiency is 2 to 15 times greater, with this difference being even more pronounced when considering their directional lighting advantages. Additionally, LEDs have a much longer lifespan due to their different light emission principles and offer benefits such as being harmless to health and the environment. As a result, LEDs are widely recognized as the most suitable light source for the next generation. 
However, the widespread adoption of LED lighting is still limited, primarily due to high costs. To make LED lighting more accessible, modular design of LED components is a key solution, as market experience has shown.

1. Light Source Modularization
This includes two modes: COB (Chip On Board) and light source devices + PCB (Printed Circuit Board).








COB Packaging
COB (Chip On Board) packaging involves attaching bare chips to an interconnecting substrate using conductive or non-conductive adhesive, followed by wire bonding to achieve electrical connection (wire bonding is not needed for flip-chip technology). This technology integrates LED chips with the substrate.
COB packaging can be divided into two main categories:
- Low Thermal Resistance Packaging
Low thermal resistance COB packaging includes aluminum-based COB, copper-based COB, and ceramic-based COB.
· Aluminum-based COB: Due to the low cost of aluminum substrates, aluminum-based COB offers an excellent cost-performance ratio, with a luminous efficiency of up to 130 LM/W. It is widely used in LED bulbs and downlights. However, due to the limited thermal conductivity of aluminum (1-2 W/m·K), it is suitable for 5-10W COB light sources.

· Copper-based COB: Copper's high thermal conductivity (380 W/m·K) allows it to be used for 20-50W COBs, with a luminous efficiency also reaching 130 LM/W. It is commonly used in LED floodlights and streetlights, though typically limited to 20-50W COBs to prevent localized overheating.

· Ceramic-based COB: Ceramic is recognized as the best material for LED packaging due to its superior thermal conductivity, insulation properties, and minimal thermal deformation. It is used in high-end, high-reliability LED lighting applications for 10-50W COBs. However, its higher cost restricts its use to premium LED lighting and high-reliability applications.










- High Reliability Packaging

For specialized lighting applications requiring high reliability, such as LED street lights, tunnel lights, explosion-proof lights, and mining lights, the reliability of LED sources is crucial. Thermal effects, static electricity, and moisture are major reliability concerns.

Thermal effects are significant as they contribute to LED degradation. According to the Arrhenius model for LED chips, every 10°C increase in junction temperature halves the LED's lifespan. Ceramic substrates, with their high thermal conductivity and insulation properties, help address thermal and static electricity effects, while encapsulation technologies further enhance reliability.












2. Light Source Devices + PCB
Light source devices combined with PCB boards aim to standardize light source modules and streamline the manufacturing process for LED lighting manufacturers.








The advantages of COB light sources, including low thermal resistance, high reliability, and cost-effectiveness, make them a necessary step toward the widespread adoption of LED lighting. Additionally, the LED device + PCB model simplifies the manufacturing process and standardizes production.

With the rapid growth of LED lighting, particularly indoor LED lights, there is a need for standardization to facilitate production and market adoption. Standard interfaces for light source products include:
- COB Standard Interface
For ceramic COBs, a fixture that provides both mechanical support and electrical connection is ideal due to the challenging nature of soldering ceramic substrates and their fragility.







- Light Source Devices + PCB Standard Interface
Adding connectors to PCBs eliminates the need for manual soldering, reduces installation time, and simplifies maintenance.

LEDs convert about 70-80% of their power into heat, making effective heat dissipation crucial to maintaining performance and lifespan. The primary heat dissipation pathways are:LEDs convert about 70-80% of their power into heat, making effective heat dissipation crucial to maintaining performance and lifespan. The primary heat dissipation pathways are:

1. 1. From the LED component to the heatsink.
   

2. 2. Heat conduction through the heatsink.

3. 3. Convection to the air.

4. 4. Radiation through the surface.

   
   

   

   
   


Key considerations for heatsink design include:

1. 1. The tightness and flatness of the contact surface between the LED component and the heatsink.

2. 2. The total surface area of the heatsink.

3. 3. The choice of heatsink material.

4. 4. Optimization of fin design for gas flow.

   
   

LED packaging is a multidisciplinary field involving optics, thermodynamics, mechanics, electronics, materials science, and semiconductors. Effective LED packaging requires a deep understanding of thermal, optical, material, and process mechanics. LED packaging design should be integrated with chip design, considering light, heat, electrical, and structural performance. Integrating various components into LED modules will advance LED lighting technology more efficiently and rapidly.

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